Leica EM TIC 3X

 

The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.

 

 

 

 

 

Leica EM RES102

 

Thin, clean, polish, cut slopes and structure your samples with the highest level of flexibility in the Leica EM RES102. The unique ion beam milling system combines the preparation of TEM, SEM and LM samples in one single benchtop unit.

 

 

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Leica EM TXP

 

The Leica EM TXP is a target preparation device for milling, sawing, grinding, and polishing samples prior to examination by SEM, TEM, and LM techniques.

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Learn more about Leica's Ion Beam Milling Systems>