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Ion Beam Milling Systems
Leica EM TIC 3X
The Triple Ion Beam Milling System, EM TIC 3X allows production of cross sections and planar surfaces for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.
Leica EM RES102
Thin, clean, polish, cut slopes and structure your samples with the highest level of flexibility in the Leica EM RES102. The unique ion beam milling system combines the preparation of TEM, SEM and LM samples in one single benchtop unit.
Leica EM TXP
The Leica EM TXP is a target preparation device for milling, sawing, grinding, and polishing samples prior to examination by SEM, TEM, and LM techniques.
Learn more about Leica's Ion Beam Milling Systems>
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