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SEM Nanoprobing and Electrical Failure Analysis

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SEM Nanoprobing and Electrical Failure Analysis
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Device characterization, and failure localization and understanding in one streamlined workflow

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Developed by Imina Technologies and point electronic, this system includes an advanced Electrical Failure Analysis (EFA) system fully integrated into a nanoprobing solution, suitable for any Scanning Electron Microscope (SEM), Focused Ion Beam (FIB) and Dual Beam microscopes.

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It enables to visualize and analyze electrical properties and failures across the broad range of devices, components, and materials, including the most advanced technology nodes that demand low-kV and short working distance or immersion mode operation.

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Key features
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  • Nanoprobing: reliable electrical contact with highly stable nanoprobers offering sub-nm precision over cm range

  • Device characterization: Measurement of IV, leakage, conductance, resistance, and capacitance with advanced software and automated workflows

  • Fault localization with Electron Beam Induced Current (EBIC), Electron Beam Absorbed Current (EBAC), Resistive Contrast Imaging (RCI) and Electron Beam Induced Resistance Change (EBIRCh) technique

  • Advanced technologies: Maximize performance, speed up your process, and enable correlative analysis

 

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To learn more visit Point Electronic >

 

© 2022 Angstrom Scientific, Inc.

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